Shin-Etsu Polymer has two kinds of front opening shipping boxes (FOSBs) used for transporting wafers between wafer and device manufacturers. We also make front opening unified pods (FOUPs) for device makers' manufacturing processes. Shin-Etsu Polymer's FOSBs and FOUPs are known for their high quality and reliability in the global semiconductor industry. Click here for details.
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FOUP300EX
FOUP300EX provides clean and secure wafer transport, optimum automation in integration.
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MW300GT
300mm wafer shipping box.
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MW200N
200mm wafer shipping box.
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MW150M
150mm wafer shipping box.
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MW150N
150mm wafer shipping box.
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MW125N
125mm wafer shipping box.
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PANEL FOUP
Front Opening Unified Pod for PLP