2020/07/04 Wafer Cases
Shin-Etsu Polymer has two kinds of front opening shipping boxes (FOSBs) used for transporting wafers between wafer and device manufacturers. We also make front opening unified pods (FOUPs) for device makers' manufacturing processes. Shin-Etsu Polymer's FOSBs and FOUPs are known for their high quality and reliability in the global semiconductor industry. Click here for details.
2020/06/28 『Shin-Etsu Carrier tape』
Packing materials for semiconductors, electronic devices.
- Embossed/Blister carrier tape
2020/06/28 『Shin-Etsu Top tape』
Heat activated sealing films for cover film of embossed carrier tapes.
- Top cover tape
2020/06/28 『Shin-Etsu Light Frame®』
Frame for wafer dicing process.