Shin-Etsu Sepla Film® is a super engineering plastic film made of PEEK.

 

[Industrial field]

Smartphone, Home electric appliances, Automotive Industry, Electrical Products, Medical, Aviation, Pipeline, Semiconductor Materials, Agriculture

Performance

It features excellent heat tolerance, sliding properties, and chemical resistance. Its advantages also include its low water absorbing property and low dielectric constant.

 

[Applications]

  • Diaphragm for speakers and receivers  
  • Impregnation for CFRTP  
  • Material for copper wire coverings  
  • Motor insulation  
  • Exterior material for batteries  
  • Material for medical equipment components  
  • Semiconductor process cover films  

Standard specification

Low crystallinity grade

  • thickness           3-9µm
  • width                650mm
  • length               1,000m
  • core diameter    6 inch

 

High crystallinity grade

  • thickness          50-250µm
  • width                650mm
  • length               50µm：300m
                             250µm：100m
  • core diameter    6 inch

 

Please contact us for product specifications such as thickness, width, length, and material of core.

 

Characteristic table

1. Mechanical properties

Item Low crystallinity grade
５μm		 High crystallinity grade
50μm		 Test method
Tensile strength(MPa) MD 105 120 Low crystallinity grade 5μm
JIS K6781

High crystallinity grade 50μm
JIS K7127
TD 100 105
Elongation(％) MD 110 180
TD 150 230
Elastic modulus(MPa) MD 2800 3300
TD 2700 3100
Relative crystallinty(％) 5 23 DSC method

(These property values are measured values and not guaranteed values.)

 

 

2. Electrical properties

Item

High crystallinity grade

50μm

Test method

Dielectric Constant(1GHz)

3.0

Cavity prturibation method

(Comply with ASTM D2520)

23±1℃ 50±5％RH

Dissipation factor(1GHz)

0.003

Dielectric breakdown voltage(kV)

8.7

IEC 60243-1

23±2℃　 50±5％RH

Dielectric breakdown strength(kV/mm)

180

Volume resistivity(Ω・㎝)

9.8×10~{16}

JIS K6911

Input voltage：DC500V

(These property values are measured values and not guaranteed values.)

 

 

3. Thermal properties

Item High crystallinity grade
50μm		 Test method
Glass transition point（℃） 149 DSC method
Melting point（℃） 337 DSC method
Coefficient of thermal expansion(ppm／℃) 53(MD)/73(TD) TMA method
Thermal conductivity(W/m・K) 0.26 Hot wire method
Heat resistance According to figure 1, 2 DMA methd

(These property values are measured values and not guaranteed values.)

Figure1.  Heat resistance 【Dynamic viscoelasticity, MD】

Figure2.  Heat resistance 【Dynamic viscoelasticity, TD】

 

 

 

4. Chemical properties

Item

High crystalline grade

(thickness)

Test method

Specific gravity

1.3(100μm)

JIS K7112

Water absorption(%)

0.3(50μm)

JIS K7209 A method　23℃×24hr

Water permeability(g／㎡・24hr.)

15（50μm）

JIS Z0208

Gas permeability

(mol/㎡・ｓ・Pa)

O_{2}

7.7×10~{-13}（50μm）

JIS K7126

N_{2}

2.1×10~{-13}（50μm）

CO_{２}

4.4×10~{-12}（50μm）

Chemical resistance

Hydrochlonic acid、37％

Retention of modulus:101%

ASTM D638

Immersed in the fluids for 30 days

Nitric acid、30%

Retention of modulus:100%

Sulfurric acid、20％

Retention of modulus:102%

Potassium hydroxide、45%

Retention of modulus:101%

Ethanol

Retention of modulus:105%

Toluene

Retention of modulus:98%

(These property values are measured values and not guaranteed values.)