Frame for wafer dicing process.


[Industrial field]



It can be used in the same process as SUS frame.It has sufficient strength although its weight is less than half of SUS frame.



  • Dicing frame


  • Cost in transition and burden on environment are less than half. It contributed to ensuring operator's safety.
  • Reduction of metal foreign substance due to regin frame.
  • It is reusable.


  • Shinetsu Light Frame is made of regin.There are light frames for 300mm, 8 inch and 6 inch wafers respectively.

Conductive remnant( particles) reduction