Frame for wafer dicing process.
It can be used in the same process as SUS frame.It has sufficient strength although its weight is less than half of SUS frame.
- Dicing frame
- Cost in transition and burden on environment are less than half. It contributed to ensuring operator's safety.
- Reduction of metal foreign substance due to regin frame.
- It is reusable.
- Shinetsu Light Frame is made of regin.There are light frames for 300mm, 8 inch and 6 inch wafers respectively.
Conductive remnant( particles) reduction