FOUP300EX provides clean and secure wafer transport, optimum automation in integration.
[Industrial field]
Semiconductor
FOUP300EX can transport 300mm Wafers securely.
[Applications]
- Front Opening Unified Pod for 300mm Wafers.
- Outstanding sealing capability to prevent particles and contamination from environment.
- Prevent particle generation and to maintain dimensional accuracy.
- Capable of conductivity through top, shell/teeth to bottom and side-rails to dissipate electric charge."
- Main parts of FOUP are made from ESD material.
- Single molded structure to minimize cleaning drying cycle time.
Option
Conductive Side Rails |
Bar Code & RF ID Tag |
UV Cut Window & Card Case |
Color Option
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