FOUP300EX provides clean and secure wafer transport, optimum automation in integration.
FOUP300EX can transport 300mm Wafers securely.
- Front Opening Unified Pod for 300mm Wafers.
- Outstanding sealing capability to prevent particles and contamination from environment.
- Prevent particle generation and to maintain dimensional accuracy.
- Capable of conductivity through top, shell/teeth to bottom and side-rails to dissipate electric charge."
- Main parts of FOUP are made from ESD material.
- Single molded structure to minimize cleaning drying cycle time.
Conductive Side Rails
Bar Code & RF ID Tag
UV Cut Window & Card Case