2020/07/04 Wafer Cases
Shin-Etsu Polymer has two kinds of front opening shipping boxes (FOSBs) used for transporting wafers between wafer and device manufacturers. We also make front opening unified pods (FOUPs) for device makers' manufacturing processes. Shin-Etsu Polymer's FOSBs and FOUPs are known for their high quality and reliability in the global semiconductor industry. Click here for details.
SEPLEGYDA is possible to provide thin conductive layer by coating. There are many formulations depending on resistivity, from low resistance(10²~10³Ω/sq) to high resistance of anti-static area(10⁴~10¹⁰Ω/sq).
- Polythiophene-base conductive polymer
2020/06/30 『Shin-Etsu Sepla Film®』
Shin-Etsu Sepla Film® is a super engineering plastic film . It is a non-stretched film made of PEEK, a super engineering plastic. It is available as either a thick or thin film.
- The high-functioning engineering plastic film
2020/06/28 『Shin-Etsu Carrier tape』
Packing materials for semiconductors, electronic devices.
- Embossed/Blister carrier tape
2020/06/28 『Shin-Etsu Top tape』
Heat activated sealing films for cover film of embossed carrier tapes.
- Top cover tape
2020/06/28 『Shin-Etsu Light Frame®』
Frame for wafer dicing process.