• Wafer Cases 2020/07/04 Wafer Cases

    Shin-Etsu Polymer has two kinds of front opening shipping boxes (FOSBs) used for transporting wafers between wafer and device manufacturers. We also make front opening unified pods (FOUPs) for device makers' manufacturing processes. Shin-Etsu Polymer's FOSBs and FOUPs are known for their high quality and reliability in the global semiconductor industry. Click here for details.

  • 『SEPLEGYDA®』 2020/06/30 『SEPLEGYDA®』

    SEPLEGYDA is possible to provide thin conductive layer by coating. There are many formulations depending on resistivity, from low resistance(10²~10³Ω/sq) to high resistance of anti-static area(10⁴~10¹⁰Ω/sq).

    • Polythiophene-base conductive polymer
  • 『Shin-Etsu Sepla Film®』 2020/06/30 『Shin-Etsu Sepla Film®』

    Shin-Etsu Sepla Film® is a super engineering plastic film . It is a non-stretched film made of PEEK, a super engineering plastic. It is available as either a thick or thin film.

    • The high-functioning engineering plastic film
  • 『Shin-Etsu Carrier tape』 2020/06/28 『Shin-Etsu Carrier tape』

    Packing materials for semiconductors, electronic devices.

    • Embossed/Blister carrier tape
  • 『Shin-Etsu Top tape』 2020/06/28 『Shin-Etsu Top tape』

    Heat activated sealing films for cover film of embossed carrier tapes.

    • Top cover tape
  • Shinetsu Light Frame 2020/06/28 Shinetsu Light Frame

    Frame for wafer dicing process.