Packing materials for semiconductors, electronic devices.
Semiconductor, Automotive, Mobile equipment, PC, Home appliances
Shin-Etsu Embossed carrier tape contributes protection to electronic devices from physical damage during handling process and storage.
Our products also enable automatically feeding in backend process.
- Semiconductor packages for SMT
- Electronic devices for SMT
- Multiple forming methods are able to support your business for suitable emboss shape and suitable production quantity.
- Available for 0201M size devices, ultra thin bare die chips and special emboss designs for IC lead protection.
- Available for W4P0.5 tapes, in order to reduce material volume.
- Available for 2D barcode printing on carrier tapes for device traceability.
- Width:4mm to 56mm
- Sheet material: Static dissipative(APET/PS/PC), Natural(PS)
- Reel:Single windings, spiral windings, and suitable diameter.
- We are able to design suitable emboss size/shape, based on each devices.
Embossed carrier tape for ultra small devices
- High Rectangularity.
- Available for 0402/0201M size devices, and W4P0.5 tapes in order to reduce material volume.
- Reduce the effect of static electricity and paper dust compared to paper carrier tapes.