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EMCHigh-frequency conductive noise suppression『SPINPEDA®

There is a function of suppressing high-frequency conductive noise. Extremely thin suppression layer is intergrated with substrate material, copper foil and coverlay film.
Suppress unnecessary high-frequency noise by locating near target conductor should be suppressed noise without conecting any conductors.
It is possible to optimize pattern layout of suppression layer by 2.5D electromagnetic field simulator.

  • SPINPEDA®copper foil
  • SPINPEDA®coverlay

Characteristics

Construction and specifications

SPINPEDA®copper foil

Noise suppression layer is formed at epoxy resin layer on copper foil which adopts the target conductor.

SPINPEDA®coverlay

Noise suppression layer is formed between PI film and adhesion layer.

Capability and effectiveness

Conformity with IEC62333-2, measuered S parameter using 50ΩMSL.

Over a wide range from low- to high-frequency, it shows high transmission attenuation rate.
It is possible that exclude bypass capacitor and support noise suppression for high-frequency band over the limit of capacitor's frequency characteristic.

Effectiveness

  • Power integrity : Countermeasure for Power Distribution Network
  • Signal integrity : Countermeasure for reducing crosstalk between power and signal line

Mounting example

Power Distribution Network

(Example of 4layers substrate using SPINPEDA®copper foile to power layer)
By suppressing high-frequency noise parasitic on power layer, it stabilizes voltage power supply.

Sectionnal view

Structure perspective view

Crosstalk exclusion

(Example of using SPINPEDA® coverlay to FPC what power and signal line are wired adjacently)
Exclude influence of the crosstalk on signal line by suppressing unnecessary high-frequency noise parasite on power line.

Sectionnal view

Usages

  • high-speed interface substrate
  • semiconductor package substrate
  • optical module substrate
  • image signal substrate etc.

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