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HOME > Products > Semiconductor Materials

Semiconductor Materials

Shin-Etsu Polymer's packaging and carrier materials are designed for protecting silicon wafers and devices from particle contamination during transportation. Our packaging materials are comprehensively designed using the right combination of materials selection, precision compound, and analysis technologies.

Shin-Etsu Polymer has two kinds of front opening shipping boxes (FOSBs) used for transporting wafers between wafer and device manufacturers. We also make front opening unified pods (FOUPs) for device makers' manufacturing processes. Shin-Etsu Polymer's FOSBs and FOUPs are known for their high quality and reliability in the global semiconductor industry.
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Wafer Cases site
Photo: FOUP-300EX
Contact FI Group, FI Division : +(81)-48-652-6290

Shin-Etsu Lightframe® reduces conductive particles by using metal tape frame and improves the reliability for packages.
Photo: Shin-Etsu Lightframe®
Contact FI Division Sales & Marketing Group I : +(81)-48-652-6290

Shin-Etsu Lightcasstte is an exclusive cassette developed for Shin-Etsu Lightframe®. Shin-Etsu Lightcasstte conbined with Shin-Etsu Lightframe® can reduces conductive particles and improves the reliability for packages.
Photo: Shin-Etsu Lightcassette
Contact FI Division Sales & Marketing Group I : +(81)-48-652-6290

Embossed Carrier Tape & Top Cover Tape

Shin-Etsu Polymer's carrier tape is used for automated mounting of electronic components. We manufacture tapes that are always precise in terms of form, dimension, and pitch. We also employ three embossing methods: press, vacuum and air compressed forming. These embossing methods allow us to manufacture components of various sizes and shapes for our customers.
Photo: Carrier tape ranging from 8 to 56 mm.
Contact EP Marketing Group, EP Division : +(81)-48-652-6040

Chip Fixture Plates

With experience and expertise in micro-perforation and flatness precision technology, Shin-Etsu Polymer develops carrier plates (called “KSPs”) for the electrode process in ceramic capacitors.
Shin-Etsu Polymer also manufactures the Shin-Etsu HSP, which enables users to select a level of adhesiveness for holding and transporting electronic components and semiconductor devices.

Photo: Carrier Plate KSP
Contact SR Group, High Performance Rubber Products Division: +(81)-48-652-6081
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Products > Semiconductor Materials
 
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