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| Shin-Etsu Polymer's packaging and carrier materials
are designed for protecting silicon wafers and devices from
particle contamination during transportation. Our packaging
materials are comprehensively designed using the right combination
of materials selection, precision compound, and analysis
technologies. |
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Shin-Etsu Polymer has two kinds
of front opening shipping boxes (FOSBs) used for transporting
wafers between wafer and device manufacturers. We also make
front opening unified pods (FOUPs) for device makers' manufacturing
processes. Shin-Etsu Polymer's FOSBs and FOUPs are known
for their high quality and reliability in the global semiconductor
industry.
Click here for
details. |
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Shin-Etsu Lightframe® reduces conductive particles by using metal tape frame and improves the reliability for packages. |
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Shin-Etsu Lightcasstte is an exclusive cassette developed for Shin-Etsu Lightframe®. Shin-Etsu Lightcasstte conbined with Shin-Etsu Lightframe® can reduces conductive particles and improves the reliability for packages. |
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Embossed Carrier Tape & Top Cover Tape |
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Shin-Etsu Polymer's carrier tape
is used for automated mounting of electronic components.
We manufacture tapes that are always precise in terms of
form, dimension, and pitch. We also employ three embossing
methods: press, vacuum and air compressed forming. These
embossing methods allow us to manufacture components of various
sizes and shapes for our customers. |
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With experience and expertise
in micro-perforation and flatness precision technology, Shin-Etsu
Polymer develops carrier plates (called “KSPs”)
for the electrode process in ceramic capacitors.
Shin-Etsu Polymer also manufactures the Shin-Etsu HSP, which
enables users to select a level of adhesiveness for holding
and transporting electronic components and semiconductor
devices. |
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