This is an anisotropic conductive heat seal connector for connection between LCD and PCB which has silver and carbon conductive lines.

 

[Industrial field]

Automobile, Information device, Home electric appliance

Performance

It is a low-resistance type and storage at room temperature is allowed.

 

[Applications]

  • Connection between LCD and PCB (Automobile products, watches,digital cameras, electronic dictionaries, industrial equipments)

Characteristics

  • This is a heat seal connector made from polyester films with silver and carbon conductive lines.
  • It is possible to handle fine pitch more than 0.2㎜.
  • It is used for connection by heat-sealing with anisotropic conductive adhesive. Connection by ZIF type can be also used.

Specifications

  • Heat seal connector made from polyester films with silver and carbon lines is coated by anisotropic conductive adhesive.

Dimension and tolerance

Item Unit Standard
Size L x H mm 100 x 150
Dimension tolerance Length (L) mm ±0.25
Height (H) H≦120±0.25 H>120±0.5
Width of conductor (Tc) mm 0.1
Pitch tolerance mm ±0.05 (P<1.0) ±0.03 (0.2≦P≦0.4)
±0.10 (P≧1.0)
Accumulative pitch (TP) mm ±0.05 (P≦0.4, TP≦50)
±0.10 (P>0.4, TP≦100)
Thickness of base film (T) μm 25
Pitch (P) mm ≧0.2
Thickness of cover film (option) μm 12 or 25

Outline dimensions

Construction

Item JS-KN type
Base Film Polyester
Conductive lines Thermosetting resin silver/carbon ink
Adhesive Gold plated carbon particles
Half-thermosetting synthetic rubber adhesive
Insulation layer Printed themoplastic synthetic rubber

※Optional: polyester cover film, polyester stiffner for ZIF connector.

Basic properties

Item KN Data Conditions
Condutive resistance ≦0.5Ω/□ 10~30ºC, 30~80%RH
Insulation resistance ≧100MΩ 10~30ºC, 30~80%RH
Peel strength (initial) ≧2.94N/cm 90°peel, 100 mm/min.
Storage time 6 months max. Sealed, 0~40ºC, RH≦50%

Bonding conditions range

Item JS-KN type
Adhesive temperature (1) 140~170ºC
Pressure 3.5±0.5MPa
Time (2) 7±2seconds (Adhesive temp.≧140ºC)

(1) This temperature should be applied only to the bonding area.
(2) Time (2) means keeping one at reaching the adhesive temperature (1).

 

※Surface should be free of dust and contamination.
※Above "BONDING CONDITION" is not specification. It is only condition which are got in our test. Your proper condition depends on heatsealing machine, material of jig, thichness and material of cushion, size and material of adherent, environment in your process and so on. Evaluation in your process should be necessary by yourself.
※The test is carried out with Shin-Etsu's own method.
※The above conditions are provided only for reference and are based upon our company's in-house tests. Applicable conditions will vary depending on the thermal capacity of equipment, cushioning material, thickness, adhesive body size, material, exoergic properties of the lower supporting jig, and a variety of other environmental factors. As such, the above conditions should be used only for reference and implemented only after thorough testing.

Note

Every item or numerical value indicated herein is measured by Shin-Etsu and out of guarantee.
The quality of the connector, which has been already assembled, is out of guarantee.
Please make sure to see about the purpose/conditions of use and practice your own test. Industrial ownership like patent doesn't guarantee the usage of the connector.