Front Opening Unified Pod for PLP

 

[Industrial field]

Semiconductor

Performance

PANEL FOUP can transport large size panels securely.

 

[Applications]

  • PLP process carrier

Characteristics

  • Conforms to SEMI Standard.
  • Mechanical interfaces with load port , Manual open / close.
  • Humidity control.

Specifications

  • Panel size:600mm×600mm / 510mm×515mm
  • 12 or 6 Slots
  • Main parts of FOUP: Metal.