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| Application of R&D Technologies |
High-frequency conductive noise suppression (SPINPEDA®) |
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There is a function of suppressing high-frequency conductive noise. Extremely thin suppression layer is
intergrated with substrate material, copper foil and coverlay film. |
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Suppress unnecessary high-frequency noise by locating near target conductor should be suppressed noise
without conecting any conductors. |
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It is possible to optimize pattern layout of suppression layer by 2.5D electromagnetic field simulator. |
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| •SPINPEDA®copper foil |
•SPINPEDA®coverlay |
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| •SPINPEDA®copper foil |
| Noise suppression layer is formed at epoxy resin layer on copper foil which adopts the target conductor. |
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| •SPINPEDA®coverlay |
| Noise suppression layer is formed between PI film and adhesion layer. |
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| Conformity with IEC62333-2, measuered S parameter using 50ΩMSL . |
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Over a wide range from low- to high-frequency, it shows high transmission attenuation rate.
It is possible that exclude bypass capacitor and support noise suppression
for high-frequency band over the limit of capacitor's frequency characteristic.
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| •Effectiveness |
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Power integrity : Countermeasure for Power Distribution Network |
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Signal integrity : Countermeasure for reducing crosstalk between power and signal line |
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