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| Application of R&D Technologies |
High-frequency conductive noise suppression (SPINPEDA®) |
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(Example of 4layers substrate using SPINPEDA®copper foile to power layer)
By suppressing high-frequency noise parasitic on power layer, it stabilizes
voltage power supply. |
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| •Sectionnal view |
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| •Structure perspective view |
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(Example of using SPINPEDA® coverlay to FPC what power and signal line are wired adjacently)
Exclude influence of the crosstalk on signal line by suppressing unnecessary
high-frequency noise parasite on power line. |
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| •Sectionnal view |
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high-speed interface substrate |
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semiconductor package substrate |
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optical module substrate |
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| image signal substrate |
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etc. |
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