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HOME > PR & IR > Topics > 2005 > We exhibited at Internepcon Japan 2005

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[January 26, 2005]

We exhibited at Internepcon Japan 2005.

One of Asia's largest international exhibitions of electronic components, Internepcon Japan 2005, took place at Tokyo Big Sight over three days, 19th - 21st January. It was attended by approximately 78,000 visitors, including those who visited Fuel Cell Expo. Our R&D Center, Connector Division, Electronics Material Handling Products Division and High Performance Rubber Products Division exhibited at the Sixth ELE TRADE, the international trade show for electronic components.
We are very grateful for the valuable opinions and impressions expressed by those who visited us, which made this a very important exhibition.

Outline of the exhibition

Period : January 19(Wed.) to 21(Fri), 2005
Location : Tokyo Big Sight
Sponsor : Reed Exhibitions Japan Ltd.

Exhibition section

[R&D Center]
1. Conductive Polymer Solutions
2. Conductive Fine-Pitch Patterning Process
3. Noise Suppression Film
4. EMI Shielding Case
5. Bipolar-Plate for PEFC

photo

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[Conector Division]
1. View-Control-Film
2. Contact-sheet for testing
3. Carrier board

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[Electronics Material Handling Products Division]
1. Industry first 4mm Width Embossed Carrier Tape
2. ESD Top Cover Tape

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[High Performance Rubber Products Division]
1. Hi performance Stickiness Plate
2. Chip fixture plate "Carrier plate (KSP)"

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<For inquiries>
[R&D Center]
Tel: +81-48-652-5986 Fax: +81-48-663-4214
[Conector Division]
Tel: +81-48-652-5913 Fax: +81-48-652-5919
[Electronics Material Handling Products Division]
Tel: +81-48-652-6040 Fax: +81-48-652-6092
[High Performance Rubber Products Division]
Tel: +81-48-652-6081 Fax: +81-48-652-6093

[Others]
Administration & Public Relations Group
Tel: +81-3-3279-1712
Fax: +81-3-3246-2529

Please click here for inquriy.
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PR & IR > Topics > 2005 > We exhibited at Internepcon Japan 2005
 
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