Shin-Etsu Polymer’s packaging and carrier materials are designed for protecting silicon wafers and devices from particle contamination during transportation. Our packaging materials are comprehensively designed using the right combination of materials selection, precision compound, and analysis technologies.
Shin-Etsu Polymer has two kinds of front opening shipping boxes (FOSBs) used for transporting wafers between wafer and device manufacturers. We also make front opening unified pods (FOUPs) for device makers' manufacturing processes. Shin-Etsu Polymer's FOSBs and FOUPs are known for their high quality and reliability in the global semiconductor industry. Click here for details.
Plastic tape frame
Shin-Etsu Lightframe® reduces conductive particles by using metal tape frame and improves the reliability for packages.
Inspection of semiconductor/electrical devices
Applied for inspection of semiconductor and high frequency devices. MT series has short conductive route, therefore, is superior in high frequency transmission. The life time is much longer than the other types. Used for extensive applications including CPU or high frequency filter inspection.
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