JS type | Heat-seal connectors

JS type Inter-Connectors consist of conductive silver/carbon traces printed on polyester film. Adhesive material, in which conductive particle is dispersed, is applied to the traces to heat-seal the connectors to other components. The adhesive type has the alternative of KN or LA. KN type is a semi thermosetting adhesive and LA type is a thermosetting adhesive. Due to the heat resistance and peel-strength of LA type, this type can be used for automotive applications. Besides, the component contains no chlorine, Both KN and LA are compatible with ZIF connector, which is easily inserted and extracted with some force.

Products catalog (PDF: 1,273KB)

 

Outline dimensions

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Dimension and tolerance

Item Unit Standard
Size L x H mm 100 x 150
Dimension tolerance Length (L) mm ±0.25
Height (H) H120±0.25 H>120±0.5
Width of conductor (Tc) mm 0.1
Pitch tolerance mm ±0.05 (P<1.0) ±0.03 (0.2P0.4)
±0.10 (P1.0)
Accumulative pitch (TP) mm ±0.05 (P0.4, TP100)
±0.10 (P>0.4, TP100)
Thickness of base film (T) µm 25
Pitch (P) mm 0.2
Thickness of cover film (option) µm 12 or 25

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Construction

Item JS-LA type JS-KN type
Base Film Polyester Polyester
Conductive lines Thermosetting resin silver/carbon ink Thermosetting resin silver/carbon ink
Adhesive Gold plated resin particles
Thermosetting adhesive
Gold plated carbon particles
Half-thermosetting synthetic rubber adhesive
Insulation layer Printed UV setting resin Printed themoplastic synthetic rubber

* Optional: polyester cover film, polyester stiffner for ZIF connector.

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Basic properties

Item LA Data KN Data Conditions
Condutive resistance 0.5Ω/ 0.5Ω/ 10~30ºC, 30~80%RH
Insulation resistance 100MΩ 100MΩ 10~30ºC, 30~80%RH
Peel strength (initial) 3.92N/cm 2.94N/cm 90°peel, 100 mm/min.
Storage time 6 months max. Sealed, 0~40ºC, RH50%

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Bonding conditions range

Item JS-LA type JS-KN type
Adhesive temperature (1) 160~190ºC 140~170ºC
Pressure 4.0±0.5MPa 3.5±0.5MPa
Time (2) 6±2seconds (Adhesive temp.160ºC) 7±2seconds (Adhesive temp.140ºC)

(1) This temperature should be applied only to the bonding area.
(2) Time (2) means keeping one at reaching the adhesive temperature (1).
* Surface should be free of dust and contamination.
* Above "BONDING CONDITION" is not specification. It is only condition which are got in our test. Your proper condition depends on heatsealing machine, material of jig, thichness and material of cushion, size and material of adherent, environment in your process and so on. Evaluation in your process should be necessary by yourself.
* The test is carried out with Shin-Etsu's own method.
* The above conditions are provided only for reference and are based upon our company's in-house tests. Applicable conditions will vary depending on the thermal capacity of equipment, cushioning material, thickness, adhesive body size, material, exoergic properties of the lower supporting jig, and a variety of other environmental factors. As such, the above conditions should be used only for reference and implemented only after thorough testing.

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Note)
Every item or numerical value indicated herein is measured by Shin-Etsu and out of guarantee.
The quality of the connector, which has been already assembled, is out of guarantee.
Please make sure to see about the purpose/conditions of use and practice your own test. Industrial ownership like patent doesn't guarantee the usage of the connector.

Products catalog (PDF: 1,273KB)

 

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