Shin-Etsu Lightframe® specifications / properties
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HOME > Products > Semiconductor Materials > Shin-Etsu Lightframe® > Specifications / Property
Semiconductor Materials

Shin-Etsu Lightframe®

Product features Specifications / Property Wafer back-end process Eco-friendly
Product specifications
Product code and name Wafer size External diameter Internal diameter Width Thickness Remarks
300LF-EP 300mm wafer 400mm 350mm 380mm 2.5mm Bar-code label type
200LF-FF 8inch wafer 296mm 250mm 276mm 2.0mm Full flat type
200LF-EP 8inch wafer 296mm 250mm 276mm 2.0mm Bar-code label type
150LF-FF 6inch wafer 228mm 194mm 212mm 1.5mm Full flat type
Properties
  Unit ASTM Measured value
Density - D792 1.95
Water absorption % (23C°24h) D570 0.11
Tensile strength MPa D538 280
Tensile modulus GPa 50.6
Strain at break % 1.0
Flexural strength MPa D790 395
Flexural modulus GPa 40.8
Temperature of deflection under load C°(1.82MPa) D648 210
Flammability - UL94 equal to HB

* This data is measured value and is not a guarantee value.
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