Shin-Etsu Lightframe® Product features
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HOME > Products > Semiconductor Materials > Shin-Etsu Lightframe® > Product features
Semiconductor Materials

Shin-Etsu Lightframe®

Product features Specifications / Property Wafer back-end process Eco-friendly
Shin-Etsu Lightframe® reduces conductive particles by using metal tape frame and improves the reliability for packages.
The reliability improvement of packages
Shin-Etsu Lightframe® prevents from conductive particle that occurs by the friction of metal frame and metal frame cassette.
Furthermore, conductive particles disappear when using to combine Shin-Etsu Lightframe® and Shin-Etsu Lightcassette.
 
Prevention of global warming issues
By being reduced to half at weight, the transportation energy and the global warming gas (CO2) output are almost reduce to half.
 
RF-ID Tag
The introduction of the traceability system (Lintec Corp.) is possible in processes such as wafer information, dicing tape information, processing conditions, mapping data.
 
Cost saving
Shin-Etsu Lightframe® and Lightcassette provide cost saving and the transportation cost is reduced to half by light weight.
 
Operator Safety
Shin-Etsu Lightframe® improves safety in your work.
 
Reduction of conductive particles
Shin-Etsu Lightframe® reduces conductive particles by using metal tape frame and improves the reliability for packages.
 
Metal frame / Metal cassette
 
  conductive particle
   
Shin-Etsu Lightframe® / Lightcassette
 
  No particle detects
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