Shin-Etsu Polymer Co., Ltd. Connector department
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METAL CONTACT TYPE
Low resistance Z-axis metal type inter-connector is based on gold plated fine pitch wire or pin. Preferred interconnect solution for LCD module and also suitable for high density PCB to PCB connection.
 
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ME-X Type
Products Details
FEATURES
ME-X type provides a revolutionary design as low resistance elastomeric Inter-Connector for very small assembly heights, developed to fulfill the market request for connections from FPC to PCB or from COG-LCD to PCB with assembly heights ranging from 0.5 mm upwards.
GB-E Type
Products Details
FEATURES
GB-E-type Inter-Connector is a compression type, which consists of gold-plated filaments lined in the conductive part and of insulating silicone rubber on both sides. This type connector makes stable connection possible with lower resistance. GB-E type could replace soldering and also be used for PCBs, which need current capacity.
GB-U Type
Products Details
FEATURES
GB-U type Inter-Connector is a compression type, which is made up of gold-plated filaments embedded densely in U-shaped sponge silicone rubber. Since the supportive material is made of sponge, connection with fewer loads is possible. GB-U type is highly suitable for connecting between LCD and PCB seen in COG method, or PCBs with high current carrying capacity.
PI Type
Products Details
FEATURES
Designed for production oriented applications, pin Contactor is embedded on plastic housing for easy handling.
Based on highly reliable low resistance metal pin, PI type is suited for high frequency application. Available for both sides plunger and one side solder type.
RP Type
Products Details
FEATURES
High Performance Device and Board to Board "Production" Socket Solution.
Compression based Z-Axis interconnection features film substrate with silver conductive electrometric columns. Column position can be arranged to suite specific application.
Low inductance and high current carrying capacity ensure reliable high speed connection Ideal solution for hard to solder large device and PCB to PCB interconnection.