An antisotropic conductive sheet based on carbon or gold plated metal wire offer exceptionally good high frequency characteristics and repeatability for IC device test and evaluation.
		To inquire about products, check the checkbox, and then press the below button. checkmarks
		FEATURES MT-type series are anisotropic conductive sheet type, which consists of soft silicone rubber and of gold-plated metal filaments embedded densely into it. This type of Inter-Connector is suitable for inspecting and connecting IC packages such as BGA, QFP or SOP. Since MT-4X type has 4-time metal density, it can be used to CSP. Especially, MT series are superrior in transmitting high cycle. FEATURES Tip of wire is protruded from the base elastomer for 20um and Ni/Au plating was done to improve contact. Initial contact start at very low compressed stage thus reduce mechanical strain on device under test. Comparing to MT-T type, MT-P type has much improved durability (Depend on device type) FEATURES MAF-type Inter-Connector consists of multiple rows of metal fibers arranged symmetrically in a sheet of silicone rubber. This type is the thinnest of metal connectors. Various shapes are available because of punch-out manufacuturing method applied. MAF-type connectors are used for extensive applications including assembly or inspection device. FEATURES AF-type Inter-Connector consists of conductive carbon fibers, which are embedded symmetrically into a sheet of silicone rubber. Since AF type is extremely thin, it is applicable between electrodes in which there's little gap. Various shapes are available because of punch-out manufacturing method used. FEATURES GB-Matrix type Inter-Connectors consist of multiple rows of metal filaments embedded symmetrically in a sheet of insulating silicone rubber. Since the pitch or the thickness is changeable up to electrode layout, GB-Matrix type is used for comprehensive applications such as PCB, assembly and testing device. FEATURES Highest density compresion based Z-Axis interconnector, GX12 is capable of testing contact electrode size Dia. 0.1mm. GX12 is capable of making contact to high I/O devices where traditional vertical probe can not make full contact. Ideal contact solution for LCD, Bumped Wafer, and Flip Chip with 0.03mm pitch Dia. 0.01mm Au plated Tangsten wire.