Please read the following Q&A on Inter-Connector and related products.
MT, GB-Matrix, MAF, AF
Q. How is the life time of MT?
- A.
- It depends on the size and the shape of device, required spec, or compression method. Read the following three basic points.
- Connect with minimum compression force (ex. around 30 g per ball for BGA).
- Conditions should be set with compression force, not with amount.
- Please make sure that electrical pads of device and inspection board stand out of resist layer.
Q. What is the cleaning method of MT?
- A.
- See the following three main methods.
- Air blow
- Soft brushing (Brush the surface of MT with a soft brush)
- Soft brushing with IPA
Q. How much is the current capacity of MT?
- A.
- A lot of gold-plated metal wires are embedded in MT type. One wire has around 50mA capacity. We offer to set over 4 wires per electrical pad, then, 50mAx4wires=200mA.
Q. How speed of frequency can be measured?
- A.
- 1 db range of MT (less 0.5mm t) is over 10Ghz (reported byGIGA-TEST-LAB). MT is often used for inspection for high frequency devices of Mobile phone such as Band Pass Filter (BPF), Antenna Switch Module (ASM),Front End Module (FEM), Voltage Control Oscillator (VCO).
Q. Do you provide IC-socket? If not, please tell any available provider of socket suitable for MT.
- A.
- We don't provide IC-socket. we can introduce the IC-socket maker on the basis of your requirements.
