Proven to be decidedly reliable, Shin-Etsu Inter-connector RP type is widely used for solder-less mounting of semiconductor devices for production. The RP type is based on newly developed low resistance silver elastomer. Custom contact design and height variations ensure "Fit" for your application. RP type is an ideal inter-connector for larger LGA device where soldering is impractical.
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		FEATURES GB-E-type Inter-Connector is a compression type, which consists of gold-plated filaments lined in the conductive part and of insulating silicone rubber on both sides. This type connector makes stable connection possible with lower resistance. GB-E type could replace soldering and also be used for PCBs, which need current capacity. FEATURES Compression based Z-Axis interconnection features film substrate with silver conductive elastomeric columns. Column position can be arranged to suite specific application. Low inductance and high current carrying capacity ensure reliable high speed connection Ideal solution for hard to solder large device and PCB to PCB interconnection. FEATURES Highest density compresion based Z-Axis interconnector, GX12 is capable of testing contact electrode size Dia. 0.1mm. GX12 is capable of making contact to high I/O devices where traditional vertical probe can not make full contact. Ideal contact solution for LCD, Bumped Wafer, and Flip Chip with 0.03mm pitch Dia. 0.01mm Au plated Tangsten wire.