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| Solder-free connection proposed by Shin-Etsu is an ideal Inter-Connect
solution to promote "Reuse & Repair"after disassembly. We
proceed with an ideology of "Gentle to the Earth and environment (Eco-Design)."
In Mobile, Medical, Space Science and other fields, our proven "Solder-Free"
Inter-Connection permits high density mounting of parts and module for automotive
cabin space. |
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| Composition image |
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| [Components] |
| Air conditioner, HI-FI system,Room mirror, sensors,
wireless communication, and other module inter-connection |
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| High density interconnection at less than 0.5mm electrode
pitch with high degree of compliance and shock absorbance to ensure
reliable connection. |
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| Composition image |
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| [Components] |
| Air conditioner, HI-FI system,Room mirror, sensors,
wireless communication, and other module inter-connection |
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| Z-axis interconnector is ideal solution for parts with
glass substrate. For design flexibilities, heat-seal connector provides
higher degree of design freedom. |
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| Composition image |
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| Enlargement |
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| View from electrode side |
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| [Components] |
| MIC, Speaker, and other telematics related modules |
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| Microphone, speaker, and the other electrical components,
Shin-Etsu inter-connector can be designed as a compliant gasket (co-molding
of connector and supporting parts) Microphone can be assembled by
simply insert into Shin-Etsu microphone connector and place on PCB.
No soldering is required. |
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