Board to Board connection GB-E GB-U PI ME-X [RP Type] characteristics High Performance Device and Board to Board "Production" Socket Solution. Compression based Z-Axis interconnection features film substrate with silver conductive electrometric columns. Column position can be arranged to suite specific application. Low inductance and high current carrying capacity ensure reliable high speed connection Ideal solution for hard to solder large device and PCB to PCB interconnection. 1.0mmH  Pitch >1.0mm  Contact Resistance 50m Ohm/pin  Contact Resistance 1nH/pin  Current Carrying Capacity 2A/pin  Compression Force 0.25-0.5N/pin  Durability <20 This connector is based on newly developed silver conductive silicone. Based on your specification, varieties of customization option are available. Thickness of substrate can be changed to suite your specific requirement. Please contact your sales engineer for specific information. 2003(C)Shin-Etsu Polymer Co., Ltd. All rights Reserved. This document may not be copied wholly or in part without prior written permission from Shin-Etsu Polymer Co., Ltd. Shin-Etsu Polymer Co., Ltd. will not bear the responsibility for negative effect incurred as a result of the use of this product, regardless of the content of this document. Contents of this document and product specification are subject to change without prier notification.

All rights reserved. Copyright(C)2005 Shin-Etsu Polymer Co., Ltd.